Optical Packaging & Assembly Engineer

About the role

Optical Packaging & Assembly Engineers at Photonic are part of a team to realize first-of-their-kind photonic all-integrated circuits for implementing truly scalable quantum technologies. You will be developing, implementing and testing robust and scalable packaging and assembly procedures for a variety of photonic circuits. As an Optical Packaging & Assembly Engineer, you are a specialist in optical alignment and assembly, process development, and NPI (New Product Introduction). You will work in a diverse, fast-paced, and multi-disciplinary team of engineers, scientists and technicians.

Please include a cover letter with your resume (in one file) describing how you would be a great fit at Photonic and what attributes you could bring to our growing team.

• Develop and implement optical packaging and assembly processes for integrated photonic devices, including high-precision active alignment to achieve optimal coupling efficiency and long-term stability
• Design, validate, and optimize alignment methods and tooling to improve accuracy, throughput, and repeatability
• Establish validation plans and characterize optical performance under relevant operating conditions
• Define scalable workflows, SOPs, and process controls to ensure consistent manufacturing outcomes
• Support New Product Introduction by partnering with design, device, test, and manufacturing teams to apply Design for Excellence methodologies like Design for Manufacturability, Design for Test, and Design for Reliability early in the development cycle. 
• Develop assembly stations integrating precision motion, optical metrology, and environmental control
• Analyze assembly, process, and test data to identify yield drivers, root causes, failure mechanisms, and opportunities for improved throughput, repeatability, and stability. 
• Collaborate across teams to develop robust, manufacturable packaging solutions
• Define qualification criteria and acceptance standards to support product release

• PhD or Master’s degree in physics, applied physics, packaging engineering, electrical engineering, or other relevant discipline 
• Knowledge of and hands-on-experience with integrated photonics and optics
• 3+ years of experience with photonic integrated circuit, semiconductor, optoelectronic, fiber optic, or related packaging design & qualification
• Working experience in new product introduction 
• Excellent teamwork, interpersonal and written communication skills. 
• Good organization, problem solving skills.
• Strong attention to detail

An exceptional candidate will bring:

• Deep hands-on expertise in high-precision optical alignment and packaging for Photonic Integrated Circuits
• Proven ability to translate research-grade photonic assemblies into robust, production-ready assembly processes
• Strong experience in data-driven process optimization including analyzing large datasets to identify yield drivers, diagnose failure mechanisms, and improve process stability
• Demonstrated contribution to New Product Introduction (NPI) and experience in Design for Excellence (DfX) methodologies with focus on Design for Manufacturability (DfM), Design for Test (DfT), and Design for Reliability (DfR)

Source: Photonic Inc.'s careers page via Pinpoint. Read by TQI on 1 Nov 2026.